Ultra-Thin 2.54mm Wire to Board Wafer Connector

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Product Details
Customization: Available
Gender: Male
Pin: 2p-22p
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Address
No. 17, Xing Long Yuan, Baishu District, Baisha Road, Cixi,5, Ningbo, Zhejiang, China
International Commercial Terms(Incoterms)
FOB, EXW, CFR, CIF, DDP
Terms of Payment
LC, T/T, PayPal
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector

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Basic Info.

Model NO.
A2543WV-2.54
Application
PCB
Certification
MSDS, CE, ISO 9001, RoHS, Reach
Terminal Material
Brass
Interface Type
AC/DC
Rated Current
3A
Rated Voltage
250V
Material
PA66.UL94V-0
Poles
2p-22p
Pitch
2.54mm
Color
Black
Transport Package
Bag+Carton
Specification
2.54mm pitch
Trademark
CL
Origin
China
HS Code
8536909000
Production Capacity
5000000PCS/Year

Packaging & Delivery

Package Size
8.00cm * 8.00cm * 6.00cm
Package Gross Weight
0.500kg

Product Description

Ultra-thin 2.54mm wire to board wafer connector
MAIN FEATURES
Pitch 2.54mm
Color Black
Poles 2p-22p
Connection direction 180° or 90°
Connection method soldering connection

TECHNICAL DATA
Standard Data
Rated voltage 250V
Rated current 3A
Material
Insulation Material PA66 ,UL94V-0
Material of current carrier brass,Tin plated
Electronical Performation
Contact  Resistance 20mΩ max
Insulation Resistance 1000MΩ min at DC500V
Withstand voltage AC 1KV for 1min
Ambient Conditions
Operation temperature -25ºC  to  +85ºC
Storage temperature -25ºC  to  +70ºC
Shelf life 2 year
Soldering  capability
Manual 30W iron,320±5ºC,3S max
Wave soldering 250±10ºC,5S max
Environmental Compliance
RoHS2.0,REACH

DRAWING
Ultra-Thin 2.54mm Wire to Board Wafer ConnectorPRODUCT PICTURES
Ultra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer Connector
CERTIFICATE
Ultra-Thin 2.54mm Wire to Board Wafer Connector
MAIN CUSTOMER
Ultra-Thin 2.54mm Wire to Board Wafer Connector
FACTORY VIEW
Ultra-Thin 2.54mm Wire to Board Wafer Connector



Ultra-Thin 2.54mm Wire to Board Wafer Connector
   SHIPPING & PAYMENT
--------------------------------------------------------------------

 
1. FedEx/DHL/TNT/UPS/EMS/SF for samples, Door-to- Door.

2. By Air or by Sea for Mass production.
Customers specifying freight forwarders or negotiable shipping methods.   
                         

3.Delivery Time: 3-7 days for samples; 10-30 days for Mass production.

 
4.Payment Detail: L/C, T/T, Western union, Paypal, or other methods.
 

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