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Ultra-Thin 2.54mm Wire to Board Wafer Connector

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Product Images of Ultra-Thin 2.54mm Wire to Board Wafer Connector

Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
Ultra-Thin 2.54mm Wire to Board Wafer Connector pictures & photos
Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector
  • Ultra-Thin 2.54mm Wire to Board Wafer Connector
    Ultra-Thin 2.54mm Wire to Board Wafer Connector

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Product Description

Ultra-thin 2.54mm wire to board wafer connector
MAIN FEATURES
Pitch 2.54mm
Color Black
Poles 2p-22p
Connection direction 180° or 90°
Connection method soldering connection

TECHNICAL DATA
Standard Data
Rated voltage 250V
Rated current 3A
Material
Insulation Material PA66 ,UL94V-0
Material of current carrier brass,Tin plated
Electronical Performation
Contact  Resistance 20mΩ max
Insulation Resistance 1000MΩ min at DC500V
Withstand voltage AC 1KV for 1min
Ambient Conditions
Operation temperature -25ºC  to  +85ºC
Storage temperature -25ºC  to  +70ºC
Shelf life 2 year
Soldering  capability
Manual 30W iron,320±5ºC,3S max
Wave soldering 250±10ºC,5S max
Environmental Compliance
RoHS2.0,REACH

DRAWING
Ultra-Thin 2.54mm Wire to Board Wafer ConnectorPRODUCT PICTURES
Ultra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer ConnectorUltra-Thin 2.54mm Wire to Board Wafer Connector
CERTIFICATE
Ultra-Thin 2.54mm Wire to Board Wafer Connector
MAIN CUSTOMER
Ultra-Thin 2.54mm Wire to Board Wafer Connector
FACTORY VIEW
Ultra-Thin 2.54mm Wire to Board Wafer Connector



Ultra-Thin 2.54mm Wire to Board Wafer Connector
   SHIPPING & PAYMENT
--------------------------------------------------------------------

 
1. FedEx/DHL/TNT/UPS/EMS/SF for samples, Door-to- Door.

2. By Air or by Sea for Mass production.
Customers specifying freight forwarders or negotiable shipping methods.   
                         

3.Delivery Time: 3-7 days for samples; 10-30 days for Mass production.

 
4.Payment Detail: L/C, T/T, Western union, Paypal, or other methods.
 

About the Supplier

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Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.
Cixi Ciliang Electronic Co., Ltd.

About Our Factory & Business Background

Address
No. 17, Xing Long Yuan, Baishu District, Baisha Road, Cixi,5, Ningbo, Zhejiang, China
Terms of Payment
LC, T/T, PayPal
International Commercial Terms(Incoterms)
FOB, EXW, CFR, CIF, DDP
Average Lead Time
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Nearest Port
NINGBO PORT, SHANGHAI PORT

Our Production Capability & Technical Expertise

Main Products
Terminal Blocks, Pipe Clamp, Hex Key Wrench, Pin Connector, Pin Header, Hardware, Hose Clamp, Wrench

Our Industry Experience & Global Business Record

Export Year
2009-12-10
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

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